導(dǎo)熱硅膠片檢測(cè)

導(dǎo)熱硅膠片檢測(cè)項(xiàng)目報(bào)價(jià)？??解決方案？??檢測(cè)周期？??樣品要求？

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GB/T 29545-2013機(jī)床數(shù)控系統(tǒng) 可靠性設(shè)計(jì)

本標(biāo)準(zhǔn)規(guī)定了機(jī)床數(shù)控系統(tǒng)可靠性設(shè)計(jì)的基本流程、方法以及評(píng)審內(nèi)容和程序。本標(biāo)準(zhǔn)適用于機(jī)床數(shù)控系統(tǒng)(以下簡(jiǎn)稱“數(shù)控系統(tǒng)”)。其他工業(yè)機(jī)械設(shè)備數(shù)控系統(tǒng)的可靠性設(shè)計(jì)可參照本標(biāo)準(zhǔn)。

GB/T 30067-2013金相學(xué)術(shù)語(yǔ)

本標(biāo)準(zhǔn)界定了金相學(xué)和金相檢驗(yàn)及其相關(guān)領(lǐng)域的術(shù)語(yǔ),主要涵蓋了光學(xué)顯微術(shù)、顯微壓痕硬度測(cè)試、樣品制備、X-射線和電子金相學(xué)、定量金相學(xué)、顯微攝影術(shù)、晶粒尺寸和夾雜物含量的測(cè)定等金相學(xué)領(lǐng)域中廣泛使用的專有名詞。本標(biāo)準(zhǔn)適用于金相學(xué)領(lǐng)域中的科研、生產(chǎn)、檢驗(yàn)、教學(xué)、出版、編制標(biāo)準(zhǔn)及國(guó)內(nèi)外科技交流。

GB/T 50668-2011節(jié)能建筑評(píng)價(jià)標(biāo)準(zhǔn)

為貫徹落實(shí)節(jié)約能源資源的基本國(guó)策，引導(dǎo)采用先進(jìn)適用的建筑節(jié)能技術(shù)，推動(dòng)建筑的可持續(xù)發(fā)展，規(guī)范節(jié)能建筑的評(píng)價(jià)，編制本標(biāo)準(zhǔn)。本標(biāo)準(zhǔn)適用于新建、改建和擴(kuò)建的居住建筑和公共建筑的節(jié)能評(píng)價(jià)。節(jié)能建筑評(píng)價(jià)應(yīng)符合下列規(guī)定：節(jié)能建筑的評(píng)價(jià)應(yīng)包括建筑及其用能系統(tǒng)，涵蓋設(shè)計(jì)和運(yùn)營(yíng)管理兩個(gè)階段；節(jié)能建筑的評(píng)價(jià)應(yīng)在達(dá)到適用的室內(nèi)環(huán)境的前提下進(jìn)行。 節(jié)能建筑的評(píng)價(jià)除應(yīng)符合本標(biāo)準(zhǔn)的規(guī)定外，尚應(yīng)符合現(xiàn)行有關(guān)標(biāo)準(zhǔn)的規(guī)定。

GB 50681-2011機(jī)械工業(yè)廠房建筑設(shè)計(jì)規(guī)范

本規(guī)范適用于下列范圍：1 新建、擴(kuò)建、改建的機(jī)械工業(yè)廠房及其附屬建筑的建筑設(shè)計(jì)；2 機(jī)械工業(yè)工廠中電離輻射室的建筑設(shè)計(jì)；3 機(jī)械工業(yè)工廠中電磁屏蔽室，屏蔽頻率為0.15MHz～30MHz利用建筑物增設(shè)屏蔽層的建筑設(shè)計(jì)。

CECS 411-2015金屬面絕熱夾芯板技術(shù)規(guī)程

本規(guī)程適用于工業(yè)與民用建筑屋面板(非上人屋面)、墻面板、天花板、內(nèi)隔墻、聲屏障等的設(shè)計(jì)及安裝。

SJ/Z 21336-2018數(shù)據(jù)鏈設(shè)備可靠性設(shè)計(jì)指南

本指導(dǎo)性技術(shù)文件規(guī)定了數(shù)據(jù)鏈設(shè)備可靠性設(shè)計(jì)的一般要求、設(shè)計(jì)準(zhǔn)則和設(shè)計(jì)方法等。本指導(dǎo)性技術(shù)文件適用于指導(dǎo)數(shù)據(jù)鏈終端設(shè)備(含天線)、鏈路綜合處理設(shè)備、網(wǎng)絡(luò)管理設(shè)備等的可靠性設(shè)計(jì)，其他數(shù)據(jù)鏈設(shè)備可參考使用。

DB11/T 512-2007建筑裝飾工程石材應(yīng)用技術(shù)規(guī)程

本規(guī)程適用于建筑裝飾工程中裝飾石材的材料、設(shè)計(jì)、加工制作、施工、驗(yàn)收以及防護(hù)、保養(yǎng)和翻新。

ISO/TTA 4-2002硅基質(zhì)上薄膜導(dǎo)熱性的測(cè)量

1.1 A standard procedure for the three-omega method is proposed for measuring the thermal conductivity ofa thin, electrically insulating film, on a substrate having a thermal conductivity significantly greater than thethermal conductivity of the film. This method is applicable to a film on a silicon substrate with the followingcharacteristics:a) the film is electrically insulating;b) the film has a thermal conductivity that is less than one tenth the thermal conductivity of silicon;c) the film is uniform in thickness and the thickness lies in the range 0,25 μm to 1 μm;d) the maximum dimensions of the film are limited by the sizes of the preparation and measurementapparatus;e) the minimum dimensions of the film are limited by the minimum size of the circuit element that can beplaced on the film surface.NOTE A specimen approximately 15 mm by 25 mm is of an appropriate size although specimens as small as10 mm × 10 mm are usable.1.2 The method is directly applicable to films of silicon dioxide on silicon wafer substrates.1.3 The method may be applicable to insulating films on other high-thermal conductivity substrates providedthat the parameters of the substrate material are substituted for the parameters of silicon used in this methodand the associated computer program.1.4 The method is applicable to measurements near room temperature.

DIN EN 675-2011建筑玻璃.熱傳遞系數(shù)(U值)測(cè)定.熱流計(jì)法;德文版本EN 675-2011

This European Standard specifies a measurement procedure to determine the thermal transmittance of glazing with flat and parallel surfaces. Structured surfaces, e.g. patterned glass, may be considered to be flat...

DIN EN ISO 472-2013塑料.詞匯表(ISO 472-2013).三種語(yǔ)言版本EN ISO 472-2013

This standard defines terms used in the plastics industry, including terms and definitions appearing in plastics standards (of ISO/TC 61), and general terms and definitions of polymer science used in all aspects of plastics technology.

BS EN 675-2011建筑玻璃.熱傳遞系數(shù)(U值)的測(cè)定.熱流計(jì)法

This European Standard specifies a measurement procedure to determine the thermal transmittance ofglazing with flat and parallel surfaces. For the purpose of this Standard, structured surfaces may beconsidered to be flat..This European Standard applies to multiple glazing with outer panes which are not transparent to far infraredradiation (in the wavelength range 5μm to 50μm), which is the case for soda lime silicate glass products,borosilicate glass and glass ceramics. Internal elements can be far infrared transparent.The procedure specified in this European Standard determines the U value (thermal transmittance) in thecentral area of glazing. The edge effects due to the thermal bridge through the spacer of an insulating glassunit or through the window frame are not included. Energy transfer due to solar radiation is also excluded.The procedure specified in this European Standard should be considered only when the thermal transmittanceof the glazing cannot be calculated in accordance with EN 673.The determination of the thermal transmittance is performed for conditions which correspond to the averagesituation for glazing in practice.

BS EN 60194-2006印制板設(shè)計(jì)、制造和組裝.術(shù)語(yǔ)和定義

This International Standard defines the terminology used in the field of printed circuitboards and printed circuit board assembly products.

BS EN 61189-2-2006印制電路板及其互連結(jié)構(gòu)和組件電氣材料的試驗(yàn)方法.互連結(jié)構(gòu)材料的試驗(yàn)方法

This part of IEC 61189 provides a catalogue of test methods representing methodologies andprocedures that can be applied to test materials used for manufacturing interconnectionstructures (printed boards) and assemblies.

BS EN 62258-1-2010半導(dǎo)體壓模產(chǎn)品.采購(gòu)和使用

This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including? wafers,? singulated bare die,? die and wafers with attached connection structures,? minimally or partially encapsulated die and wafers.The standard defines the minimum requirements for the data that are needed to describe suchdie products and is intended as an aid to the design of and procurement for assembliesincorporating die products. It covers the requirements for data, including? product identity? product data? die mechanical information? test, quality, assembly and reliability information? handling, shipping and storage informationIt covers the specific requirements for the data that are needed to describe the geometricalproperties of die, their physical properties and the means of connection necessary for their usein the development and manufacture of products. It also contains, in the annexes, a vocabularyand list of common acronyms.